AIM’s V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.
Supplied as standard in lead-free alloy SAC305.
Key Product Features & Benefits:
– Low Voiding: as low as 1% on BGA and <5% on BTCs
– Capable of Consistent Printing with Area Ratio < 0.66
– High Reliability (SIR)
– Drop-in for M8
– Available in SAC305 T4
– REACH and RoHS Compliant*
– ROL0 per IPC J-STD-004 and ROL1 per J-STD-004B (3.3.1)
AIM’s Product Range available from the Solder Connection throughout Ireland and Northern Ireland only.
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