Senju have launched their new Low Temperature, Lead-Free Solder Paste, Milatera L29-155HF. Primarily developed as a high reliability soldering alloy 155HF offers increased ductility and a greater reliability during an drop shock testing, compared to Tin/Bismuth alloys. 155HF is also a direct replacement to traditional SAC alloys, with a minimum peak temp of 185°C, compared to SAC305’s 245°C. As a result, 155HF allows for the reduction of energy consumption by up to 50% within the Surface Mount process area.
155HF achieves great wetting characteristics and reduced evidence of solder balling and voiding, providing a level of stability not seen in this type of material before. During testing, both usable screen life and favourable storage conditions were achieved, offing engineers great latitude within the production process. This new Senju alloy has certainly gone a long way towards bridging the gap of SAC alloys.
As with all Senju solder pastes the powders are produced in house within strict manufacturing parameters, The individual particles are perfectly spherical and contain little if any oxidation, all of which gives a very stable and consistent solder paste.
Key Product Features and Benefits:
– Continuous Printing up to 8 hours
– No Viscosity change during extended storage periods.
– Reduced solder balling and voiding compared to existing SN/BI alloys
– Low temp reflow reduces Head-in-Pillow (HIP) & Non-Wet Opens.
– Reduced Energy Consumption. Lowering of CO2 emissions – Non-Wet Open decrease
– Flux Classification: ROL0 to J-STD-004B
– Melting Temperature: 140-145°C
– Available in lead-free alloy L29 (Sn58/Bi/Sb/Ni)
– Available in Type 4 Particle Size
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