MG Chemicals Thermal Solutions
MG Chemicals Thermal Interface Materials work by displacing air gaps between components and heat sinks to help conduit heat out of the circuit, preventing overheating and ultimately circuit failure.
Thermal Interface Materials
MG Chemicals carries three distinct chemistries of Thermal Solutions designed to cover a full range of production requirements. For permanent bonds, thermally conductive adhesives are available in a variety of consistencies and working times. Alternatively thermal paste displaces air pockets, which ensures full contact between the two surfaces, and prevents overheating.
When choosing a Thermal Solution, consider requirements including conductivity, working time, adhesion, and processing to find the right material. For advice on your application contact our Sales Office to speak to our technical team.
Applying Thermal Paste
When placed between heat-generating components and heat sinks, a thermal paste displaces air pockets, which ensures full contact between the two surfaces, and prevents overheating.
In this short video, we demonstrate how to properly apply a thermal grease at the CPU/heatsink interface which helps regulate the PCB temperature and prevent overheating. We demonstrate surface preparation methods along with common applications methods that ensures maximum coverage while minimizing bond line thickness.