MG Chemicals 860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
For a silicone-free thermal paste, try 8616.
This product is supplied in 4g Pouch, 25ml Jar, 150g Tube, 470ml Jar and 3.78L Pail.
If you are looking for large quantities, please contact our Sales Office to discuss.
Key Product Features & Benefits:
– Supplied in 4g Pouch, 25ml Jar, 150g Tube, 470ml Jar and 3.78L Pail.
– Thermal conductivity of 0.7 W/(m·K)
– High dielectric strength
– Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
– Excellent corrosion resistance
– Non-bleeding heat transfer paste
– Non-electrically conductive
– Long service life
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